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Product Overview
The COMPAQ CSCM Series Stress Control Mastic Tape is specifically engineered for medium and high voltage (MV/HV) cable terminations and joints, providing effective electric field stress relief in high-performance power systems.
This water-resistant, self-fusing mastic exhibits strong adhesion to connectors, insulation layers, and other cable components, ensuring secure void filling even in irregular shapes. Made from thermally stabilised blended polyolefins, the mastic is enhanced with specialised additives that provide high permittivity and superior electrical stress control properties, making it an essential component in reliable jointing and termination systems.
Equilibrates the electric field, reducing stress concentrations in MV/HV applications.
Merges seamlessly into a void-free layer for consistent dielectric performance.
Bonds firmly to connectors, insulation, and semi-conductive surfaces.
Suitable for both dry and oil-filled environments.
Enhances stress grading performance in electrical accessories.
Conforms easily to irregular shapes and varying diameters.
Yellow, for quick identification during installation.
| Parameter | Specification |
|---|---|
| Density | 1.3 g/cm³ (ASTM D 792) |
| Permittivity | ≥ 15 (ASTM D 150) |
| Tensile Strength | 0.1 MPa (ASTM D 638) |
| Loss Factor (50Hz) | 0.035 |
| Volume Resistivity | ≥ 1.8 × 10¹¹ Ω·cm (IEC 60093) |
| Dielectric Constant | 10–15 (IEC 250) |
| Dielectric Strength | ≥ 3 kV/mm (IEC 60243) |
| Heat Shock (105°C) | PASS |
| Ultimate Elongation | ≥ 500% (ASTM D 638) |
| Adhesive & Self-Amalgamation | Good |
Applications
Selection Criteria
To identify the correct kit configuration, kindly confirm the following project details:
01
CSCM-1 – 25 mm width, 2 mm thickness, 300 mm length
02
CSCM-2 – 30 mm width, 2 mm thickness, 300 mm length
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CSCM-3 – 30 mm width, 3 mm thickness, 400 mm length
04
Other sizes available on request
05
Supplied as strips or rolls with release paper on both sides
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Recommended storage: In original packaging, protected from moisture, dust, heat, and direct sunlight
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